Intel and Applied Materials Team Up to Accelerate Next-Gen AI Chip Processors

Founding partnership at Silicon Valley’s EPIC Centre targets advanced Foveros 3D packaging, power delivery, and transistor engineering. Intel Foundry and Applied Materials have entered into a multi-site process technology collaboration spanning front-end and back-end semiconductor manufacturing, including transistor engineering, advanced packaging, interconnects, and power delivery architecture. The joint engineering effort will take place across Intel’s […]