Blog Review: Oct. 28

The eBeam Initiative’s Jan Willis reports insights from an expert panel discussion on large-format masks , equipment investment, high-NA EUV, and curvilinear masks. Siemens’ Kevin Rinebold and Andras Vass-Varnai explore the shift toward chiplet-based and heterogeneous design and why system technology co-optimization and multiphysics analysis are becoming essential for addressing thermal, power, and integration bottlenecks. Synopsys’ Sumit Vishwakarma argues that physical AI systems will require