Siemens expands Agentic AI collaboration to tackle 3D IC power and thermal challenges with Nvidia

Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with Nvidia. The latest updates combine the self-verifying agentic AI capabilities introduced at DAC 2026 with accelerated computing to address one of advanced packaging's most demanding hurdles: electrical, power, thermal and codesign for 3D ICs. The new capability orchestrates Siemens’ electrothermal analysis portfolio into a single autonomous workflow.